Semiconductor Packaging

Contents

 

 

Preface

Authors

Partial list of abbreviations, acronyms, and symbols

Section I: Semiconductor packages

Chapter 1 History and background

1.1 Objectives

1.2 Introduction

1.3 Brief history

1.3.1 Hermetic packaging

1.3.2 Plastic packaging

1.4 Wire bonding process flow

1.5 Flip-chip process flow comparison

1.6 Equipment

1.7 Material interactions

Bibliography

Chapter 2 Package form factors and families

2.1 Objectives

2.2 Introduction

2.3 Package outline standardization

2.4 Leaded package families

2.4.1 Dual lead package family

2.5 Quad lead package family

2.6 Substrate-based package families

2.6.1 Ball grid array package family

2.7 Chip scale packages

2.7.1 Substrate-based chip scale packages

2.7.2 Quad flat no lead

2.8 Stacked-die package ...