Semiconductor Packaging

Partial list of abbreviations, acronyms, and symbols

 

 

 

ACLV—autoclave

AES—Auger electron spectroscopy

A1N—aluminum nitride

A1₂O₃—alumina, aluminum oxide

ASIC—application-specific integrated circuit

CMOS—complementary metal oxide semiconductor

CCD—charge coupled device

CSP—chip scale package

CTE—coefficient of thermal expansion

DIP—dual in-line (through-hole leads) package

DRAM—dynamic random access memory

DSC—differential scanning calorimetry

DSP—digital signal processor

EFO—electronic flame off

EIA—Electronics Industries Alliance

EDS or EDX—energy-dispersive X-ray spectroscopy

ENIG—“Electroless Nickel Immersion Gold”

ESD—electrostatic discharge

FAB—free air ball

FPGA—field programmable gate arrays

FTIR—Fourier transform infrared spectroscopy ...