Preface
Semiconductor packaging assembly and testing is an important manufacturing step necessary to create electronic products. The subject is not understood in much depth, as compared to a subject like circuit design. It is generally believed that this is due to the nature of the topic, as back-end processing of semiconductors is a multidisciplinary area, encompassing materials science, mechanical design, electrical layout and modeling, and many other engineering specialties. This book specifically addresses that shortcoming, especially in the area of materials used for packaging semiconductors and their interactions.
Simply put, semiconductor packages are not monolithic entities but are made up of many different components interlocked ...
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