Novel Advances in Microsystems Technologies and Their Applications

3	Mechanically Flexible Interconnects and TSVs Applications in CMOS/ MEMS Integration Hyung Suk Yang, Paragkumar Thadesar, Chaoqi Zhang and Muhannad Bakir

CONTENTS

3.1      Introduction

3.2      Need for Integration of MEMS and Circuitry

3.3      Conventional Method of Integration

3.3.1      Monolithic Integration

3.3.2      Hybrid Integration

3.3.3      Emerging Method of Integration and 3D Integration of CMOS and MEMS

3.4      Flexible I/Os and MFIs

3.4.1      Fabrication of MFI

3.4.2      Mechanical Testing of MFI

3.5      TSV for MEMS

3.5.1      Challenges of Fabricating TSVs in Thick Chip

3.5.1.1      Stress

3.6      Seed-Layer Fabrication

3.7      Elimination of CMP for Post-MEMS TSV Fabrication

3.8      Summary

References

3.1    INTRODUCTION ...