Contents

Preface

Editors

Contributors

PART I Organic and Flexible Electronics

Chapter 1    Device Modelling for SPICE Simulations in Organic Technologies

Anis Daami

Chapter 2    Nanoscale Phase Separation and Device Engineering in Polymer Solar Cells

Swaminathan Venkatesan and Qiquan Qiao

Chapter 3    Mechanically Flexible Interconnects and TSVs: Applications in CMOS/MEMS Integration

Hyung Suk Yang, Paragkumar Thadesar, Chaoqi Zhang and Muhannad Bakir

Chapter 4    Wafer-Scale Rapid Electronic Systems Prototyping Platform: User Support Tools and Thermo-Mechanical Validation

Mikäel Guillemot, Hai Nguyen, Mohammed Bougataya, Yves Blaquière, Ahmed Lakhssassi, Mary Shields and Yvon Savaria

PART II Imaging and Display Technologies

Chapter 5    MIRASOL ...

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