4.3 Issues Related to CMOS Scaling
4.4 Porphyrin SAMs as Copper Diffusion Barriers
4.4.1 Copper/Low-k Technologies in ULSI Metallization
4.4.2 Cu Diffusion Barriers in ULSI Metallezation
4.4.3 Porphyrin SAMs as Cu Diffusion Barriers in ULSI Metallization
4.4.3.1 Bias–Temperature–Stress Analysis
4.4.3.2 Secondary Ion Mass Spectrometry
4.5 Porphyrin SAMs For Metal Gate Work Function Tuning
4.5.1 Potential Gate Electrodes for Work Function Engineering
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