Thermal Spreading and Contact Resistance

6Multisource Analysis for Microelectronic Devices

Several approaches for computing the thermal spreading resistance and/or heat source temperature have been developed for a rectangular substrate with single or multiple discrete sources. Several notable methodologies from the literature are discussed below.

In the case of multiple heat sources, several approaches are found in the open literature. Hein and Lenzi (1969) obtained a solution for an IC package using Fourier transforms. In their development, the heat source is specified by means of a Poisson equation using a piecewise function to model discrete heat sources. Both the source plane and sink plane were convectively cooled using uniform heat transfer coefficients. Kokkas (1974) obtained ...