Thermal Design, 2nd Edition

Thermal Design, 2nd Edition

by HoSung Lee
Released June 2022
Publisher(s): Wiley
ISBN: 9781119685975

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Book description

Thermal Design

Discover a new window to thermal engineering and thermodynamics through the study of thermal design

Thermal engineering is a specialized sub-discipline of mechanical engineering that focuses on the movement and transfer of heat energy between two mediums or altered into other forms of energy. Thermal engineers must have a strong knowledge of thermodynamics and the processes that convert generated energy from thermal sources into chemical, mechanical, or electrical energy — as such, thermal engineers can be employed in many industries, particularly in automotive manufacturing, commercial construction, and the HVAC industry. As part of their job, thermal engineers often have to improve a current system to make it more efficient, and so must be aware of a wide array of variables and familiar with a broad sweep of systems to ensure the work they do is economically viable.

In this significantly updated new edition, Thermal Design details the physical mechanisms of standard thermal devices while integrating essential formulas and detailed derivations to give a practical understanding of the field to students. The textbook examines the design of thermal devices through mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. Moreover, it presents information on significant thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems — all of which are increasingly important and fundamental to numerous fields such as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space.

Readers of the Second Edition of Thermal Design will also find:

  • A new chapter on thermoelectrics that reflects the latest modern technology that has recently been developed
  • More problems and examples to help clarify points throughout the book
  • A range of appendices, including new additions, that include more specifics on topicscovered in the book, tutorials for applications, and computational work
  • A solutions manual provided on a companion website

Thermal Design is a useful reference for engineers and researchers in me chanical engineering, as well as senior undergraduate and graduate students in mechanical engineering.

Table of contents

  1. Cover
  2. Title Page
  3. Copyright
  4. Dedication
  5. Preface to the Second Edition
  6. Preface to the First Edition
  7. About the Companion Website
  8. 1 Introduction
    1. 1.1 INTRODUCTION
    2. 1.2 HUMANS AND ENERGY
    3. 1.3 THERMODYNAMICS
    4. 1.4 HEAT TRANSFER
    5. PROBLEMS
    6. REFERENCES
  9. 2 Heat Sinks
    1. 2.1 LONGITUDINAL FIN OF RECTANGULAR PROFILE
    2. 2.2 HEAT TRANSFER FROM FIN
    3. 2.3 FIN EFFECTIVENESS
    4. 2.4 FIN EFFICIENCY
    5. 2.5 CORRECTED PROFILE LENGTH
    6. 2.6 OPTIMIZATIONS
    7. 2.7 PLATE FIN HEAT SINKS
    8. 2.8 MULTIPLE FIN ARRAY II
    9. 2.9 THERMAL RESISTANCE AND OVERALL SURFACE EFFICIENCY
    10. 2.10 FIN DESIGN WITH THERMAL RADIATION
    11. PROBLEMS
    12. COMPUTER ASSIGNMENTS
    13. PROJECT
    14. REFERENCES
  10. 3 Heat Pipes
    1. 3.1 OPERATION OF HEAT PIPE
    2. 3.2 SURFACE TENSION
    3. 3.3 HEAT TRANSFER LIMITATIONS
    4. 3.4 HEAT PIPE THERMAL RESISTANCE
    5. 3.5 VARIABLE CONDUCTANCE HEAT PIPES (VCHP)
    6. 3.6 LOOP HEAT PIPES
    7. 3.7 MICRO HEAT PIPES
    8. 3.8 WORKING FLUID
    9. 3.9 WICK STRUCTURES
    10. 3.10 DESIGN EXAMPLE
    11. PROBLEMS
    12. DESIGN PROBLEM
    13. REFERENCES
  11. 4 Compact Heat Exchangers
    1. 4.1 INTRODUCTION
    2. 4.2 FUNDAMENTALS OF HEAT EXCHANGERS
    3. 4.3 DOUBLE‐PIPE HEAT EXCHANGERS
    4. 4.4 SHELL‐AND‐TUBE HEAT EXCHANGERS
    5. 4.5 PLATE HEAT EXCHANGERS (PHE)
    6. 4.6 PRESSURE DROPS IN COMPACT HEAT EXCHANGERS
    7. 4.7 FINNED‐TUBE HEAT EXCHANGERS
    8. 4.8 PLATE‐FIN HEAT EXCHANGERS
    9. 4.9 LOUVER‐FIN‐TYPE FLAT‐TUBE PLATE‐FIN HEAT EXCHANGERS
    10. 4.10 PLATE‐FINNED HEAT PIPE HEAT EXCHANGER
    11. PROBLEMS
    12. REFERENCES
  12. 5 Thermoelectric Design
    1. 5.1 INTRODUCTION
    2. 5.2 THERMOELECTRIC GENERATORS
    3. 5.3 THERMOELECTRIC COOLERS AND HEAT PUMPS
    4. 5.4 OPTIMAL DESIGN
    5. 5.5 THOMSON EFFECT, EXACT SOLUTION, AND COMPATIBILITY FACTOR
    6. 5.6 THERMAL AND ELECTRICAL CONTACT RESISTANCES FOR MICRO AND MACRO DEVICES
    7. 5.7 MODELING OF THERMOELECTRIC GENERATORS AND COOLERS WITH HEAT SINKS
    8. 5.8 APPLICATIONS
    9. PROBLEMS
    10. COMPUTER ASSIGNMENT
    11. PROJECTS
    12. COMPUTER ASSIGNMENTS
    13. COMPUTER PROJECTS
    14. REFERENCES
  13. 6 Thermoelectric Materials
    1. 6.1 CRYSTAL STRUCTURE
    2. 6.2 PHYSICS OF ELECTRONS
    3. 6.3 DENSITY OF STATES, FERMI ENERGY, AND ENERGY BANDS
    4. 6.4 THERMOELECTRIC TRANSPORT PROPERTIES FOR ELECTRONS
    5. 6.5 PHONONS
    6. 6.6 LOW‐DIMENSIONAL NANOSTRUCTURES
    7. 6.7 GENERIC MODEL OF BULK SILICON AND NANOWIRES
    8. 6.8 THEORETICAL MODEL OF THERMOELECTRIC TRANSPORT PROPERTIES
    9. PROBLEMS
    10. REFERENCES
  14. 7 Solar Cells
    1. 7.1 INTRODUCTION
    2. 7.2 QUANTUM MECHANICS
    3. 7.3 DENSITY OF STATES
    4. 7.4 EQUILIBRIUM INTRINSIC CARRIER CONCENTRATION
    5. 7.5 EXTRINSIC SEMICONDUCTORS IN THERMAL EQUILIBRIUM
    6. 7.6 GENERATION AND RECOMBINATION
    7. 7.7 RECOMBINATION
    8. 7.8 CARRIER TRANSPORT
    9. 7.9 MINORITY CARRIER TRANSPORT
    10. 7.10 CHARACTERISTICS OF SOLAR CELLS
    11. 7.11 ADDITIONAL TOPICS
    12. 7.12 MODELING
    13. 7.13 DESIGN OF A SOLAR CELL
    14. PROBLEMS
    15. REFERENCES
  15. Appendix A Thermophysical Properties
    1. REFERENCES
  16. Appendix B
    1. B.1 OPTIMAL DIMENSIONLESS PARAMETERS FOR TEGS WITH ZT∞2 = 1 (SEE FIGURE B.1 AT THE END OF TABLES)
    2. B.2 OPTIMAL DIMENSIONLESS PARAMETERS FOR TECS WITH ZT∞2 = 1 (SEE FIGURE B.2 AT THE END OF TABLES)
  17. Appendix C Pipe Dimensions
  18. Appendix D Periodic Table
  19. Appendix E Thermoelectric Properties
    1. E.1 BISMUTH TELLURIDE P‐TYPE
    2. E.2 BISMUTH TELLURIDE N‐TYPE
    3. E.3 LEAD TELLURIDE P‐TYPE
    4. E.4 SILICON GERMANIUM N‐TYPE
    5. E.5 SKUTTERUDITES N‐TYPE
    6. E.6 ZINTL COMPOUND N‐TYPE
    7. REFERENCES
  20. Appendix F Fermi Integral
  21. Appendix G Hall Factor
    1. REFERENCES
  22. Appendix H Curve Fitting of Working Fluids
    1. H.1 CURVE FIT FOR WORKING FLUIDS CHOSEN
    2. H.2 CURVE FITTING FOR WORKING FLUID PROPERTIES CHOSEN
  23. Appendix L Tutorial for MathCAD
    1. L.1 TUTORIAL PROBLEM FOR MATHCAD
  24. Appendix M Conversion Factors
  25. Index
  26. End User License Agreement

Product information

  • Title: Thermal Design, 2nd Edition
  • Author(s): HoSung Lee
  • Release date: June 2022
  • Publisher(s): Wiley
  • ISBN: 9781119685975