Foreword
The widespread growth of high-speed and broadband systems poses increasing challenges to the designers of modern information and communication equipment. Effective signal integrity (SI) and electromagnetic compatibility (EMC) solutions are fundamental for the marketing of reliable devices able to ensure perfect functionality and compliance with legal standards.
In the area of high-speed design, it is necessary to analyze power and signal integrity issues at an early stage of the design, before the prototype board is fabricated. Typical signal integrity issues are reflections and crosstalk. Typical power integrity issues are power supply system input impedance, simultaneous switching noise, printed circuit board (PCB) resonance, decoupling capacitor placement, and edge radiations. Power distribution systems play an important role in power and signal integrity and electromagnetic interference (EMI). It is a common experience that the EMC of digital systems improves significantly when boards are subjected to careful power integrity and signal integrity analysis. To this end, it is necessary to analyze the input impedance between power and ground and further provide an equivalent circuit model for signal integrity analysis. Also, the prediction of simultaneous switching noise must be performed in the time domain, employing non-linear models for drivers and receivers.
This book provides a good overview of the above-mentioned SI and EMC issues, and discusses how to design boards ...
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