Physical Design for 3D Integrated Circuits

Table of contents

1. Cover
2. Half Title
3. Title Page
4. Copyright Page
5. Table of Contents
6. Preface
7. Acknowledgments
8. Editors
9. Contributors
10. SECTION I 3D Integration Overview
    1. Chapter 1 2.5D/3D ICs: Drivers, Technology, Applications, and Outlook
    2. Chapter 2 Overview of Physical Design Issues for 3D-Integrated Circuits
    3. Chapter 3 Detailed Electrical and Reliability Study of Tapered TSVs
    4. Chapter 4 3D Interconnect Extraction
11. SECTION II 3D Physical Design Methods for 3D Integration
    1. Chapter 5 3D Placement and Routing
    2. Chapter 6 Power and Signal Integrity Challenges in 3D Systems-on-Chip
    3. Chapter 7 Design Methodology for TSV-Based 3D Clock Networks
    4. Chapter 8 Design Methodology for 3D Power Delivery Networks
12. SECTION III Reliability Concerns for 3D Integration
    1. Chapter 9 Live Free or Die Hard: Design for Reliability in 3D Integrated Circuits
    2. Chapter 10 Thermal Modeling and Management for 3D Stacked Systems
    3. Chapter 11 Exploration of the Thermal Design Space in 3D Integrated Circuits
    4. Chapter 12 Dynamic Thermal Optimization for 3D Many-Core Systems
    5. Chapter 13 TSV-to-Device Noise Analysis and Mitigation Techniques
13. SECTION IV CAD Design Tools and Future Directions for 3D Physical Design
    1. Chapter 14 Overview of 3D CAD Design Tools
    2. Chapter 15 Design Challenges and Solutions for Monolithic 3D ICs
    3. Chapter 16 Design of High-Speed Interconnects for 3D/2.5D ICs without TSVs
    4. Chapter 17 Challenges and Future Directions of 3D Physical Design
14. Index