Book description
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.
The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference:
- Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs
- Supplies state-of-the-art solutions for challenges unique to 3D circuit design
- Features contributions from renowned experts in their respective fields
Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Table of contents
- Cover
- Half Title
- Title Page
- Copyright Page
- Table of Contents
- Preface
- Acknowledgments
- Editors
- Contributors
- SECTION I 3D Integration Overview
- SECTION II 3D Physical Design Methods for 3D Integration
-
SECTION III Reliability Concerns for 3D Integration
- Chapter 9 Live Free or Die Hard: Design for Reliability in 3D Integrated Circuits
- Chapter 10 Thermal Modeling and Management for 3D Stacked Systems
- Chapter 11 Exploration of the Thermal Design Space in 3D Integrated Circuits
- Chapter 12 Dynamic Thermal Optimization for 3D Many-Core Systems
- Chapter 13 TSV-to-Device Noise Analysis and Mitigation Techniques
- SECTION IV CAD Design Tools and Future Directions for 3D Physical Design
- Index
Product information
- Title: Physical Design for 3D Integrated Circuits
- Author(s):
- Release date: December 2017
- Publisher(s): CRC Press
- ISBN: 9781351830195
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