Chapter Sixteen. Silicon Wafer and Thin Film Measurements
16.1. Important Measurements
In silicon MEMS the silicon wafer provides both the substrate and the material for the active device layer. Additionally, polished silicon wafers are often bonded on the processed wafers to form hermetically enclosed packages. Mainly three types of wafers are used: polished bulk, epitaxial, and silicon-on-insulator (SOI) wafers. If device processing is performed from the top side only, single-side polished wafers are sufficient. It is quite common, though, to process the wafer from both sides; in these cases double-side polished (DSP) wafers are used.
Polished bulk wafers are essentially uniform throughout, and membrane or cantilever structures are processed ...
Get Handbook of Silicon Based MEMS Materials and Technologies now with the O’Reilly learning platform.
O’Reilly members experience books, live events, courses curated by job role, and more from O’Reilly and nearly 200 top publishers.
